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Your search returned 18 records. Click on the hyperlinks to view further details of Titles.. |
Magazine Name : Ieee Transactions On Components Hybrids And Manufacturing Technology
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Year : 1992 Volume number : 15 Issue: 01 |
Microcarrier For Lsi Chip Used In The Hitac M-880 Processor Group
(Article)
Subject:
Microcarrier
,
Lsi Chip
,
Hitac M-880
,
Processor Group
Author:
Takashi
Inoue
Haruhiko
Matsuyama
page:
07
-
14
Microcarrier For Lsi Chip Used In The Hitac M-880 Processor Group
(Article)
Subject:
Hitac M-880
,
Processor Group
,
Microcarrier
,
Lsi Chip
Author:
Takashi
Inoue
Haruhiko
Matsuyama
Mamoru
Tanaka
page:
07
-
14
A Multilevel Epoxy Substrate For Flip-Clip Hybrid Multichip Module Applications
(Article)
Subject:
Flip-Chip
,
Hybrid
,
Multichip Module
,
Epoxy
Author:
A.
Okuno
Eiichi
Tsunashima
page:
103
-
106
Polyamic Alkyl Esters: Versatile Polyimide Precursors For Improved Dielectric Coatings
(Article)
Subject:
Polyamic Alkyl Esters
,
Versatile Polyimide Precursors
,
Improved Dielectric Coatings
,
Polyimide
Author:
James L.
Hendrick
Do Y.
Yoon
Willi
Volksen
page:
107
-
113
Ir Microscopic Observation Of Plastic Coated Tab Inner Lead Bonds Degrading During Thermal Cycling
(Article)
Subject:
Thermal Cycle Stability
,
Inner Lead Bonding Technique
,
Ir Microscopic Observation
,
Plastic Coated Tab
Author:
Peter
Alpern
Rainer
Tilgner
page:
114
-
117
Critical Temperatures Of Contact Materials
(Article)
Subject:
Contact Material
,
Influence Of Cathode Temperatures
,
Dielectric Strength
,
Critical Temperature
Author:
Bingjun
Ding
Xiaotian
Wang
Jimei
Wang
page:
118
-
120
Conducting Metallic Oxide Contacts On Superconducting Yba2 Cu3o7-X Thin Films
(Article)
Subject:
Conducting Metallic Oxide
,
Superconducting
,
Yba2cu3o7-X
,
Thin Films
Author:
Wayne A
Anderson
Quan-Xi
Jia
page:
121
-
125
Effect Of Adding Sn To Graphite On Electrical Contact Resistance Between Sliding Surfaces Of Graphite And Cu
(Article)
Subject:
Graphite
,
Electrical Contact
,
Contact Resistance
,
Sliding Surfaces Of Graphite And Cu
Author:
Yasuo
Imada
Hidetaka
Ito
Koichi
Nakajima
page:
126
-
132
An Electric Double-Layer Capacitor With High Capacitance And Low Resistance
(Article)
Subject:
Electric Double Layer Capacitor
,
High Capacity
,
Low Resistance Contact
,
Capacitance
Author:
Atsushi
Nishino
Kiyoaki
Imoto
Akihiko
Yoshida
Hajime
Yoneda
page:
133
-
138
Packaging Of Gaas Signal Processors On Multichip Modules
(Article)
Subject:
Packaging
,
Gaas Processor
,
Signal Processing
,
Multichip Modules
Author:
Barry K.
Gilbert
page:
15
-
28
State-Of-The-Art Multichip Modules For Avionics
(Article)
Subject:
The State Of The Art
,
Multichip Modules
,
Avionics
,
Evolutionary Systems
Author:
John K.
Hagge
page:
29
-
42
A Review Of The Skin Effect As Applied To Thin Film Interconnections
(Article)
Subject:
Ulsi
,
Vlsi
,
Skin Effect
,
Thin Film
Author:
Lih-Tyng
Hwang
Lwona
Turlik
page:
43
-
55
Electrical Design Technology For Low Dielectric Constant Multilayer Ceramic Substrate
(Article)
Subject:
Low Dielectric Constant
,
Multilayer Cermic Capacitor
,
Substrate
,
Electrical Design Technology
Author:
Akihiro
Sasaki
Yuzo
Shimada
page:
56
-
62
Comparative Evaluation Of Optical Waveguides As Alternative Interconnections For High Performance Packaging
(Article)
Subject:
Interconnections
,
Optical Waveguides
,
Comparative Evaluation
,
High-Performance
Author:
Lih-Tyng
Hwang
Bradley D.
Mccredie
Lwona
Turlik
page:
63
-
72
New Packaging Of A Chip On A Board By A Unique Printing Method
(Article)
Subject:
New Packaging
,
Chip On A Board
,
Unique Printing Method
,
Transfer Molding Packaging
Author:
A.
Okuno
T
Hashimoto
Noritaka
Oyama
Koichiro
Nagai
page:
73
-
77
A Quantitative Technique To Analyze Materials Trade-Off For Sem `E'
(Article)
Subject:
Sem
,
Trade Off
,
Quantitative
,
Analyzed
Author:
Frank R.
Field
Lee H.
Ng
page:
78
-
86
Resistance Computations For Multilayer Packaging Structures By Applying The Boundary Element Method
(Article)
Subject:
Resistance Calculation
,
Computational Methods
,
Boundary Element Method(Bem)
,
Multilayer Structure
Author:
Ruey-Beei
Wu
page:
87
-
96
A Feasibility Study For The Fabrication Of Planar Silicon Multichip Modules Using Electron Beam Lithography For Precise Location And Interconnection Of Chips
(Article)
Subject:
Feasibility Study
,
Lithography
,
Electron Beam
,
Multichip Modules
Author:
Andy
Hopper
Alan
Jones
Roderick Alan
Augur
page:
97
-
102
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